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Base Board Introduction

Product Overview

The A8550PZ1-132 motherboard (APX8550) is a high-performance embedded motherboard based on the Qualcomm QCS8550 flagship SoC, featuring a hexa-core (octa-core optional) Kryo CPU, Adreno 740 GPU, 48 TOPS NPU, 8K VPU, and Spectra ISP. The motherboard supports dual Gigabit RJ45 Ethernet ports, USB 3.0 Type-A, and extended USB 2.0 connectors, along with MIPI DSI/CSI, HDMI, LVDS, and eDP display interfaces. It also supports multiple SPI, I2C, RS485, UART, I2S, CAN, and GPIO general-purpose bus interfaces.

An onboard WiFi 6 + BT 5.3 module, a standard Mini-PCIe interface supporting 4G communication expansion, a Micro SD card slot for external storage expansion, and audio input/output interfaces are included. Purpose-built for high-compute, high-stability scenarios such as robotics, industrial AI, and high-end IPC/VR applications.

Product Appearance

A8550PZ1-132 motherboard physical photo: A8550MA1 Base Board

Interface Diagram

A8550MA1 Base Board Interface Diagram - Front

Physical Dimensions

ItemParameter
PCBA Dimensions135 mm × 90 mm (±0.5 mm)
Board Thickness1.6 mm (±10%)
Mounting Hole Diameter6 mm
Screw Hole Spec∮3.2 mm × 4 (±10%)
Overall Dimensions (with components)135 mm × 90 mm × 14 mm, PCB top-side height 9 mm

For detailed dimensional information, contact APLUX FAE at support@aidlux.com.

Specifications

CategoryDescription
CPUQCS8550, 1× Prime Core + 2× Gold Core (4× optional) + 3× Silver Core, max 3.2 GHz
DDRLPDDR5x 12 GB (8 GB / 12 GB / 16 GB / 24 GB optional)
Storage128 GB UFS 3.1 standard, expandable up to 512 GB
TF CardPush-push TF card slot, up to 256 GB
USB2× Type-A (USB 3.0 ×2), 4× internal 1.25 mm vertical connectors (USB 2.0 ×4), 4× 2.0 mm horizontal connectors (USB 2.0 ×4)
HDMIStandard HDMI display interface, supports 4K@60 Hz output
eDPIndustry-standard 30-pin eDP connector
LVDS30-pin industry-standard dual-channel LVDS interface, supports VESA/JEITA formats, up to 1080p output
Backlight ControlIndustry-standard LCD backlight control interface (LVDS and eDP), supports backlight on/off and brightness adjustment
Camera2× MIPI CSI × 4-lane
I2S1× I2S interface, supports low-power voice processing and audiophile-quality playback (4 microphones)
Ethernet2× 10/100/1000M auto-negotiation RJ45 ports
Mini-PCIeIndustry-standard m-PCIe 4G module interface
SIM CardPush-push Nano SIM card slot, supports mobile communications
CAN2× CAN header interfaces
Headphone/MicCTIA-standard 4-pole headset 3.5 mm jack (L-R-GND-MIC)
I2CI2C headers and FPC interfaces (shared with SPI), supports I2C touch expansion
SPI2× independent SPI header interfaces, 1× shared with I2C
GPIOSupports external expansion of 10× 1.8 V GPIO
Serial Communication2× RS485 + 6× UART
ButtonsFlash key (RECOVERY) + Power key
Power InputSupports 10–24 V wide-voltage DC input
Debug InterfaceSupports external 3.3 V serial debug
Line OutStandard L/R channel line output (header interface + headphone jack)
WiFi / BluetoothOnboard WiFi 6 + BT 5.3
EnvironmentalOperating temperature -25°C ~ +50°C, operating humidity 0%–95% (non-condensing)
OSAndroid 15 / Ubuntu 22.04

Functions & Interface Definitions

USB 2.0 Interfaces (J8 / J9 / J10 / J11)

usb2.0x4

J8, J9, J10, and J11 are all USB 2.0 HOST interfaces, derived from the PCIe-to-USB chip uPD720201K8. Each interface has an independent load switch with 1.2 A load capacity. The connector type is 1×4×2.0 mm with latch, manufacturer: TXGA, model: FWF20029-S04B25NAM.

Pin Definition:

Pin#DefinitionNote
15V5 V output
2DMUSB differential data -
3DPUSB differential data +
4GNDDigital ground

USB 2.0 Interfaces (J12 / J13 / J14 / J15)

usb2.0x4

J12, J13, J14, and J15 are all USB 2.0 HOST interfaces, derived through the USB HUB chip FE1.1, therefore sharing 480 Mbps bandwidth. J12 and J13 share one load switch, and J14 and J15 share another load switch. The maximum load capacity per pair is 1.2 A. The connector type is 1×4×1.25 mm with latch, manufacturer: XUNPU, model: WAFER-GH1.25-4PLB.

Pin Definition:

Pin#DefinitionNote
15V5 V output
2DMUSB differential data -
3DPUSB differential data +
4GNDDigital ground

eDP Connector (J18)

eDP connector

[J18] Standard eDP connector (1×30×0.5 mm), supports eDP v1.4 standard. The connector is a bottom-contact, drawer-type FPC connector. Manufacturer: Jushuo Electronics, model: AFC07-S30FCC-00.

Pin Definition:

Pin#DefinitionNote
1NCNC
2GNDDigital ground
3D1-Data differential signal
4D1+Data differential signal
5GNDDigital ground
6D0-Data differential signal
7D0+Data differential signal
8GNDDigital ground
9AUX+Auxiliary differential signal
10AUX-Auxiliary differential signal
11GNDDigital ground
12LCD_3V3LCD_3V3 power output
13LCD_3V3LCD_3V3 power output
14NCNC
15GNDDigital ground
16GNDDigital ground
17ETX_HPDHot-plug detect signal
18GNDDigital ground
19GNDDigital ground
20GNDDigital ground
21GNDDigital ground
22BL_ENBacklight enable signal
23BL_PWMPWM control signal
24NCNC
25NCNC
26BL_12VBL_12V power output
27BL_12VBL_12V power output
28BL_12VBL_12V power output
29BL_12VBL_12V power output
30NCNC

Backlight Connector (J20)

Backlight connector

[J20] Backlight connector (1×6×2.0 mm), provides 12 V backlight power. If the backlight power exceeds 20 W, it is recommended to use a separate backlight power board (12 V adapter powered directly by the adapter; 24 V adapter requires adjusting the onboard power supply). Supports PWM backlight control and backlight on/off. Connector manufacturer: Bossie, model: BX-PH2.0-6PWZ-R.

Pin Definition:

Pin#DefinitionNote
1GNDDigital ground
2GNDDigital ground
3PWMPWM control signal
4BL_ON/OFFBacklight on/off signal
5BL_12V12 V power output
6BL_12V12 V power output

Camera Connectors (J22 / J23)

Camera connectors

J22 and J23 are camera connectors with identical signal definitions. Both support MIPI 4-Lane CSI with a maximum of 2.5 Gbps per lane. The connector type is 1×22×0.5 mm single-row drawer-type FPC connector. Manufacturer: Huade Gongchuang, model: 0.5K-A-22PB.

Pin Definition:

Pin#DefinitionNote
1GNDDigital ground
2LN0_MData differential signal
3LN0_PData differential signal
4GNDDigital ground
5LN1_MData differential signal
6LN1_PData differential signal
7GNDDigital ground
8CLK_MClock differential signal
9CLK_PClock differential signal
10GNDDigital ground
11LN2_MData differential signal
12LN2_PData differential signal
13GNDDigital ground
14LN3_MData differential signal
15LN3_PData differential signal
16GNDDigital ground
17RSTReset signal
18LEDLED indicator signal
19GNDDigital ground
20SCLI2C bus clock signal
21SDAI2C bus data signal
22CAM_3V33.3 V power output

CAN Connectors (J27 / J28)

CAN connectors

J27 and J28 are CAN connectors with identical signal definitions. Both support CAN 2.0B and CAN FD. The connector type is 1×3×2.5 mm. Manufacturer: TXGA, model: FWF25029-S03S25W5M.

Pin Definition:

Pin#DefinitionNote
1HData
2LData
3VSSCAN shield ground

RS485 Interfaces (J37 / J38)

RS485 interfaces

[J37] and [J38] are RS485 interfaces (1×4×1.25 mm) with identical signal definitions. Both have onboard 120 Ω termination resistors. Connector manufacturer: XUNPU, model: WAFER-GH1.25-4PLB.

Signal Definition:

Pin#DefinitionNote
1VCC3.3 V power output
2BDifferential signal
3ADifferential signal
4VSSRS485 shield ground

Important Notes

Please observe the following key notes when assembling and using the APX8550 motherboard:

  • Environmental requirements: Relative humidity 0–95% non-condensing, operating temperature -25°C ~ +50°C, storage temperature -40°C ~ +85°C.
  • ESD protection: ESD precautions must be taken during product assembly and transportation.
  • Cable lengths: Interface cables connected to this board should not be excessively long, as this may affect signal quality.
  • Mechanical stress: Do not allow the board to be twisted or subjected to heavy pressure that could cause deformation during product assembly.
  • Short circuit prevention: Prevent short circuits between the bare board and other peripherals.
  • LCD panel connection: When connecting an external LVDS or eDP LCD panel, verify that the panel drive voltage and current meet the requirements, and note the pin 1 orientation of the panel cable connector.
  • Backlight power: When connecting an external LVDS or eDP LCD panel, verify that the backlight voltage and current meet the requirements. If the LCD backlight power exceeds 20 W, using a separate power board for backlight power is recommended.
  • Peripheral IO levels and current: When connecting external devices to interfaces (USB, GPIO, serial, I2C, SPI, HDMI, etc.), verify that the peripheral's IO levels and current meet the requirements. When using the power pins on the motherboard connectors to supply power to peripherals, the current on regular power pins must not exceed 100 mA. When connecting peripherals via serial ports, voltage level matching is also required (1.8 V, 3.3 V TTL, and RS-485 levels).

Document Information

  • Official product name: A8550PZ1-132 Motherboard
  • Full product code: A8550PZ1-132
  • Document version: V1.0
  • Release date: 2026-06-11
  • Classification: Public
  • Applicable scope: A8550PZ1-132 motherboard and product integration projects based on this hardware platform

© 2026 Chengdu APLUX Intelligence Technology Ltd. Unauthorized reproduction, distribution, or use beyond the scope specified in this document is prohibited without written permission.